Power chips are connected to outside circuits through packaging, and their performance relies on the assistance of the product packaging. In high-power scenarios, power chips are generally packaged as power components. Chip interconnection refers to the electrical connection on the top surface of the chip, which is usually aluminum bonding wire in typical modules. ^
Typical power component plan cross-section
Currently, commercial silicon carbide power modules still primarily utilize the packaging technology of this wire-bonded typical silicon IGBT component. They face problems such as huge high-frequency parasitical criteria, inadequate warm dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict using silicon carbide semiconductors. The display of exceptional performance. In order to address these troubles and totally manipulate the substantial potential advantages of silicon carbide chips, numerous brand-new packaging modern technologies and remedies for silicon carbide power components have emerged in recent years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually established from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have developed from gold wires to copper cords, and the driving pressure is price reduction; high-power gadgets have developed from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product efficiency. The higher the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared with standard bonding packaging methods, Cu Clip technology has the complying with benefits:
1. The connection in between the chip and the pins is made from copper sheets, which, to a specific degree, replaces the common cable bonding approach between the chip and the pins. For that reason, an one-of-a-kind package resistance value, higher present flow, and better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can completely save the cost of silver plating and inadequate silver plating.
3. The item look is totally constant with normal products and is mainly made use of in servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding technique is much more expensive and complex, but it can attain much better Rdson and better thermal results.
( copper strip)
Copper sheet plus wire bonding method
The resource pad uses a Clip method, and the Gate makes use of a Cord method. This bonding method is a little more affordable than the all-copper bonding method, saving wafer area (suitable to really tiny gate areas). The process is less complex than the all-copper bonding approach and can get much better Rdson and much better thermal impact.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding hammered copper, please feel free to contact us and send an inquiry.
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